Wednesday, August 6, 2014

eASIC and Mobiveil Collaborate on Optimized NVMe Solution for SSD Systems

New Implementation Extends Mobiveil’s NVMStorTM SSD Platform Targeting eASIC Devices

SANTA CLARA, Calif - Wednesday, August 6th 2014 [ME NewsWire]
Flash Memory Summit 2014
(BUSINESS WIRE) eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and Mobiveil, Inc. a fast growing supplier of silicon intellectual property today announced support for Mobiveil’s NVMe platform implemented in eASIC devices. The platform includes PCI Express, NVM Express, DDR3 and NAND flash controllers IP that is optimized to take advantage of the unique eASIC Single Mask Adaptable ASIC technology. UNEX™, Mobiveil’s NVM Express IP, has passed 1.1 specification compliance and interoperability tests conducted by the University of New Hampshire (UNH).
“eASIC is enabling the rapid deployment of SSD technology at substantially lower cost and up to 70% lower power than alternative solutions.” said Jasbinder Bhoot, vice president of worldwide marketing at eASIC. “By working with Mobiveil, customers will have access to a complete NVMe solution running in cost, power and performance optimized eASIC devices.”
eASIC’s Single Mask Adaptable ASIC™ devices provide customers fast-time to market solutions that are used today in a variety of SSD solutions. With PCIe compliant serial transceivers and high performance logic and memory, eASIC devices are optimized to implement complete NVMe solutions including NAND flash controllers with integrated ECC and high performance PCI Express with DMA.
“We are pleased to be working with eASIC to extend our NVMStore solution for the SSD market.” said Ravi Thummarukudy, CEO of Mobiveil, Inc. “The combination of our complete NVMe platform with eASICs optimized devices allows customers to implement solutions that can be immediately and cost effectively taken to market.”
Customers can learn more about NVMe solutions using Mobiveil IP and eASIC devices by visiting Mobiveil at booth 721 at the Flash Memory Summit held at the Santa Clara Convention Center, August 5-7, 2014.
About Mobiveil, Inc.
Mobiveil is a fast-growing technology company that specializes in development of Silicon Intellectual Properties (SIPs), platforms and solutions for the networking, storage and enterprise markets. Mobiveil’s team leverages decades of experience in delivering high-quality, production proven, high-speed serial interconnect Silicon IP cores along with customer and standard form factor hardware boards to leading customers worldwide. Mobiveil is headquartered in Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan, and Peoples Republic of China. For more information, please visit www.mobieviel.com.
About eASIC
eASIC is a fabless semiconductor company offering breakthrough single mask ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.
Contacts
Press Contacts:
eASIC Corporation
Brent Przybus, 408-855-9200
bprzybus@easic.com




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